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Reduces friction-induced heat and prevents premature breakdown. Dynamic Power Splitting Note: The JUQ150 issue is
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The heat sink pad, which is designed to transfer heat away from the component to the PCB, fails to make proper contact, leaving the component with nowhere to dissipate heat.
Always utilize the embedded thermistor (if equipped) or attach an external K-type thermocouple near the baseplate. Program your control software to trigger an audible alarm or initiate a safe shutdown sequence if the temperature crosses a predefined safety threshold (e.g., 90°C baseplate temperature). Conclusion